MPI Manual Probe Systems

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Description

MPI TS150, TS200 & TS300 manual probe systems are open, easy to use and cost effective yet highly accurate. These systems are designed for precision analysis of substrates and wafers up to 150, 200 and 300mm.
They may be configured to support a wide variety of applications such as Failure Analysis, Design Validation/IC Engineering, Wafer Level Reliability, MEMS, High Power and Device Characterization and Modeling as well.

TS 50 wafer probe system designed for IC Engineering, Single Die probing and academic use in DC/CV and RF measurement applications. Wafers up to 50mm
TS 150 engineering wafer probe system is a cost effective yet highly accurate manual probe system designed for precision analysis of substrates and 150mm wafers
TS 150-HP engineering wafer probe system is a cost effective yet highly accurate manual probe system designed for precision analysis of substrates and 150 mm wafers
TS 150-THZ engineering wafer probe system is a cost effective yet highly accurate manual probe system designed for precision analysis of substrates and 150 mm wafers. The TS150-THZ may be configured to support a wide variety of RF and millimeter wave (mmW) applications such as broadband up to 110 GHz, banded wave guide, sub-THz, load-pull and RF noise
TS 200 engineering wafer probe system is a cost effective yet highly accurate manual probe system designed for precision analysis of substrates and 200 mm wafers
TS 200-SE wafer probe systems with ShieldEnvironment™ provide maximum EMI shielding and allow low noise device on-wafer measurements for wide verity of applications
TS 300 engineering wafer probe system is a cost effective yet highly accurate manual probe system designed for precision analysis of substrates and 300 mm wafers
TS 300-SE is designed to ensure advanced EMI/RFI/light-tight shielding, ultra-low noise, low leakage measurement capabilities on 300 mm wafer in a temperature range from -60 to +300°C

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